Photonic and electronic co-integration solutions

Details are subject to change.

  • Organisers

    Xuhan GuoShanghai Jiao Tong University, China
    Patty Stabile, TU/e, Netherlands
    Lars ZimmermannIHP, Germany

  • Subcommittees

    SC2 – Photonic Devices & Technologies
    SC3 – Photonic Integrated Circuits, Assemblies & Packaging

  • Day & Time

    18.09.2022, 14:00 – 17:30

  • Location

    Room Shanghai

  • Description

    By following the standard CMOS fabrication processes in the microelectronics industry, silicon or III/V photonics are emerging as the platforms of choice for large-scale photonic integration circuits (PICs) that offer the well-known advantages of low-cost at high-volume and high yield as well as scalability, respectively. However, co-integration of electronics with photonics is becoming critical for actually exploiting the high bandwidth, reduced power consumption, further shrink footprint and most importantly guaranteeing all this at lower cost. Novel co-integration schemes and further improved functionalities are needed to go beyond the limitations posed by the intrinsic material capabilities and speed imitations at the electro-optical interfaces. This workshop provides opportunities to discuss and debate the latest technologies on which photonics and electronics can be co-integrated and synergically operate to satisfy requirements in bandwidth and speed. The aim of this workshop is to compare performance, pinpoint limitations and stimulate the envisioning of novel schemes for future technology development.

  • Programme

    Session 1: Technological solutions to co-integration (90 min, 12 min per speaker + 30 min discussion)
    Integrating monolithic InP photonic circuits with high-speed electronics, Kevin Williams, TU/e, Netherlands
    Electronic-Photonic Design Automation, James Pond, Ansys, Canada
    MASSTART: Path for high Volume Manufacturing of Data Center Transceivers, Tolga Tekin, Fraunhofer IZM, Germany
    Perspective on Silicon Photonics Foundry, Anthony Yu, GLOBALFOUNDRIES, USA
    Dense Integration of Photonics and Electronics Through Micro-transfer Printing, Peter Ossieur, imec, Belgium
    Panel Discussion

    Coffee Break (30 min)

    Session 2: Advancing photonic-electronic systems by co-integration (90 min, 12 min per speaker + 30 min discussion)
    Co-integration for Data Center Transceivers beyond 400G, Hanjo Rhee, Sicoya, Germany
    Integration of Photonics and Electronics for Coherent Applications, Mehrdad Ziari, Infinera, USA
    Applications and Demonstrations of an Optic-Electronic-Optic Interferometer, Sebastian Randel, Karlsruhe Institute of Technology, Germany
    Integrated CMOS-Compatible Femtosecond Lasers for Photonic ADCs, Franz Kärtner, Center for Free-Electron Laser Science & University of Hamburg, Germany
    Reservoir Computing with Optical Weights, Stijn Sackesyn, UGent-imec, Belgium
    Panel Discussion

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